{"id":2227,"date":"2023-01-26T16:00:18","date_gmt":"2023-01-26T16:00:18","guid":{"rendered":"https:\/\/apcom.pl\/correct-heat-dissipation-in-electronic-components\/"},"modified":"2023-01-27T15:44:05","modified_gmt":"2023-01-27T15:44:05","slug":"correct-heat-dissipation-in-electronic-components","status":"publish","type":"post","link":"https:\/\/apcom.pl\/en\/correct-heat-dissipation-in-electronic-components\/","title":{"rendered":"Correct heat dissipation in electronic components"},"content":{"rendered":"<div class=\"wpb-content-wrapper\" id=\"wpb-content-root\"><p>[vc_row][vc_column width=&#8221;1\/2&#8243;][vc_column_text]<\/p>\n<h2><span style=\"color: #b7020d;\">Correct heat dissipation in electronic components<\/span><\/h2>\n<p>\ud83d\udd25 Correct heat dissipation in electronic components, is a process that reduces the risk of thermal damage. In addition, ensuring better thermal conductivity allows to increase the performance and lifetime of components such as processors. Throughout this process, the key is the proper application of thermal transfer material (e.g. paste, silicone or grease with the appropriate admixtures) between the heat-generating and heat-receiving components.<\/p>\n<p>\u27a1\ufe0f Next to show you an example of the process of applying thermal paste to a processor using <a href=\"https:\/\/apcom.pl\/en\/automation\/\">industrial roboto<\/a>. <a title=\"stosowanie uszczelki wylewanej.\" href=\"https:\/\/youtu.be\/ZbvD8g_GCbo\" rel=\"dofollow noopener\" target=\"_blank\">Another application of the industrial robot.<\/a>[\/vc_column_text][\/vc_column][vc_column width=&#8221;1\/2&#8243;][vc_single_image image=&#8221;2222&#8243; img_size=&#8221;full&#8221;][\/vc_column][\/vc_row]<\/p>\n<\/div>","protected":false},"excerpt":{"rendered":"<p>[vc_row][vc_column width=&#8221;1\/2&#8243;][vc_column_text] Correct heat dissipation in electronic components \ud83d\udd25 Correct heat dissipation in electronic components, is a process that reduces the risk of thermal damage. In addition, ensuring better thermal conductivity allows to increase the performance and lifetime of components such as processors. Throughout this process, the key is the proper application of thermal transfer&hellip;<\/p>\n","protected":false},"author":4,"featured_media":2216,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[92],"tags":[],"class_list":["post-2227","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-92","description-off"],"_links":{"self":[{"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/posts\/2227","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/comments?post=2227"}],"version-history":[{"count":3,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/posts\/2227\/revisions"}],"predecessor-version":[{"id":2230,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/posts\/2227\/revisions\/2230"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/media\/2216"}],"wp:attachment":[{"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/media?parent=2227"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/categories?post=2227"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/apcom.pl\/en\/wp-json\/wp\/v2\/tags?post=2227"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}